China's market space in the field of electronic components is growing rapidly. With the increasing demand for MLCC and chip resistance in 5g industry related applications and new energy vehicles, the demand for electronic components is increasing. It is expected that the total sales of electronic components will reach 2100 billion yuan by 2023. 　　The relevant person in charge of Xianghe industry (603500), A-share listed company, recently said that the revenue share of the company's electronic device business segment has increased to 24.12%. The company plans to expand from capacitor parts production to component production and consider completing it through extended M & A. In addition, at present, the track fastener production capacity of Xianghe industry has increased to 18 million sets / year, with more than 200 million yuan of orders on hand and nearly 30 million overseas orders on hand. 　　Industry insiders predict that the price rise of electronic components industry is still expected in 2021. The novel coronavirus pneumonia epidemic has spread since last year. The growth of consumer electronics in the first half of the year is expected to be higher. The demand for new energy vehicles and photovoltaic power surges in the second half of the year, and the demand for new energy vehicles and photovoltaic power surges. This makes the IC IC design and foundry industry, the key components of the electronic components industry such as passive components, panels and memory devices become the most popular market in 2021. At present, the impact of the epidemic has not been completely eliminated, the supply and demand pattern of the industry is still tight, and the price rise is still expected. In addition, factors such as the withdrawal of Japanese manufacturers from the medium and low-end market are accelerating the domestic substitution process of electronic components. Relevant listed companies are expected to benefit.

　　According to Taiwan DIGITIMES technology network, TSMC, the leading man hour of chip generation processing, recently announced that it would expand the cost of chip generation processing. From the fourth quarter of this year, the price of advanced processes below 12 nm will be increased by 10%, and the price of mature processes above 12 nm will be increased by 20%. 　　The price increase of TSMC has increased again since the first price increase of TSMC from last autumn to this spring. The main reason behind this is that demand is very strong, and the secondary reason is that for the American capitalists behind TSMC, raising prices will help them make more profits. 　　When can domestic chip enterprises break the game? 　　TSMC's price rise has had a huge impact on domestic chip design enterprises. Due to the rising cost of chip generation processing, the cost of chip design companies such as Hisilicon and Ziguang has increased greatly. 　　In the final analysis, all this is because there is no lithography machine. The lithography machine can not be bought with money, because there is a strong interest relationship between ASML and the United States. 　　According to the current form, it is basically impossible for Chinese enterprises to buy lithography machines from ASML. 　　Then you have to make it yourself. The technology of self-made lithography machine is still difficult for domestic enterprises to break through and solve in the short term, but this does not mean that they have been unable to break through these technologies. It is believed that with the continuous exploration of domestic chip enterprises, China can realize the complete autonomy of chip design and processing in the future, and completely get rid of the dependence on foreign chips.

　　The birth of a chip can be divided into two links: design and manufacturing. The process of chip manufacturing is like building a house with LEGO. After the wafer is used as the foundation, and then the chip manufacturing process is stacked up layer by layer, the desired IC chip can be produced. However, it is useless to have a strong manufacturing capacity without a design drawing. So what is the development process of IC design? Next, the staff of zhixinqiang will introduce to you and have a look. 　　The complete IC design and development process covers the following links: 　　Market Research and product definition: system application requirements, market scale, competition strategy, product specification index, cost strategy, development planning, etc; 　　Product system design: system architecture design (including low-power design and DFT design strategy), software and hardware division, detailed design specification definition, etc; 　　Product process selection: process node, process type, IP resources, packaging and test planning, etc; 　　Product front end design: analog and mixed signal circuit schematic design, analog simulation verification, digital circuit RTL code design, digital simulation verification, IP design integration, analog and digital mixed simulation verification, software design, software simulation verification, system integration and verification, FPGA prototype implementation and verification, etc; 　　Product back-end design: analog and mixed signal circuits: customized layout design, IP integration, DFM, physical verification, post layout simulation, etc; Digital circuit and SOC: design synthesis (including low-power design and DFT, IP integration, etc.), layout planning, clock tree design, wiring, timing convergence, power integrity, signal integrity, DFM, formal verification, physical verification, post layout simulation, etc; 　　Product data export: design data export (GDSII tape out), IP merge, final data verification, mask data online inspection (JDV), mask data release, etc; 　　Product Outsourcing: mask manufacturing, wafer manufacturing, CP (circuit probe) testing, packaging and dicing, finished product testing, tape braiding and packaging, etc; 　　Product sample verification: CP (circuit probe) test, function verification, performance verification, design correction and verification, reliability verification, etc; 　　Small batch trial production of products: process angle commissioning, yield monitoring, yield improvement, production solidification, etc; 　　Mass production: mass production, logistics and supply chain management, stable supply, customer service, etc. 　　The above is the IC design and development process introduced to you. I hope I can help you. After reading this article, I believe you have a better understanding of IC design.