Development process of IC Design_ Zhixinqiang

　　The birth of a chip can be divided into two links: design and manufacturing. The process of chip manufacturing is like building a house with LEGO. After the wafer is used as the foundation, and then the chip manufacturing process is stacked up layer by layer, the desired IC chip can be produced. However, it is useless to have a strong manufacturing capacity without a design drawing. So what is the development process of IC design? Next, the staff of zhixinqiang will introduce to you and have a look.

　　The complete IC design and development process covers the following links:

　　Market Research and product definition: system application requirements, market scale, competition strategy, product specification index, cost strategy, development planning, etc;

　　Product system design: system architecture design (including low-power design and DFT design strategy), software and hardware division, detailed design specification definition, etc;

　　Product process selection: process node, process type, IP resources, packaging and test planning, etc;

　　Product front end design: analog and mixed signal circuit schematic design, analog simulation verification, digital circuit RTL code design, digital simulation verification, IP design integration, analog and digital mixed simulation verification, software design, software simulation verification, system integration and verification, FPGA prototype implementation and verification, etc;

　　Product back-end design: analog and mixed signal circuits: customized layout design, IP integration, DFM, physical verification, post layout simulation, etc; Digital circuit and SOC: design synthesis (including low-power design and DFT, IP integration, etc.), layout planning, clock tree design, wiring, timing convergence, power integrity, signal integrity, DFM, formal verification, physical verification, post layout simulation, etc;

　　Product data export: design data export (GDSII tape out), IP merge, final data verification, mask data online inspection (JDV), mask data release, etc;

　　Product Outsourcing: mask manufacturing, wafer manufacturing, CP (circuit probe) testing, packaging and dicing, finished product testing, tape braiding and packaging, etc;

　　Product sample verification: CP (circuit probe) test, function verification, performance verification, design correction and verification, reliability verification, etc;

　　Small batch trial production of products: process angle commissioning, yield monitoring, yield improvement, production solidification, etc;

　　Mass production: mass production, logistics and supply chain management, stable supply, customer service, etc.

　　The above is the IC design and development process introduced to you. I hope I can help you. After reading this article, I believe you have a better understanding of IC design.